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STM32L151VD Datasheet(PDF) 151 Page - STMicroelectronics

Part # STM32L151VD
Description  Ultra-low-power 32-bit MCU ARM® Cortex®-M3, 384KB Flash, 48KB SRAM, 12KB EEPROM, LCD, USB, ADC, DAC, memory I/F
PDF  154 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L151VD Datasheet(HTML) 151 Page - STMicroelectronics

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DocID022027 Rev 11
151/154
STM32L151xD STM32L152xD
Revision History
153
07-Apr-2014
7
Updated current consumption in Section : Features.
Updated Section 2.2: Ultra-low-power device continuum.
Updated Table 3: Functionalities depending on the operating power
supply range..
Added VDD= 1.71 to 1.8 V operating power supply range in Table 5:
Functionalities depending on the working mode (from Run/active down
to standby).
Updated Section 3.10: LCD (liquid crystal display) to remove VLCD rail
decoupling.
Updated Section 3.16: Touch sensing.
Updated Figure 5: Pin loading conditions.
Updated Figure 6: Pin input voltage.
Updated Figure 11: Power supply scheme.
Updated Table 10: Voltage characteristics (added row).
Updated Table 11: Current characteristics.
Updated Table 13: General operating conditions. Removed figures
“Power supply and reference decoupling (VREF+ not connected to
VDDA) and “Power supply and reference decoupling (VREF+ connected
to VDDA).
Updated Table 15: Embedded internal reference voltage calibration
values and moved inside Section 6.3.3: Embedded internal reference
voltage.
Updated Section 6.3.4: Supply current characteristics.
Updated Table 17: Current consumption in Run mode, code with data
processing running from Flash, Table 18: Current consumption in Run
mode, code with data processing running from RAM, Table 19: Current
consumption in Sleep mode, Table 20: Current consumption in Low-
power run mode, Table 21: Current consumption in Low-power sleep
mode, Table 22: Typical and maximum current consumptions in Stop
mode, and Table 23: Typical and maximum current consumptions in
Standby mode.
Added Section 6.3.5: Wakeup time from low-power mode.
Updated Section 6.3.6: External clock source characteristics.
Moved Figure 14: High-speed external clock source AC timing diagram
after Table 26: High-speed external user clock characteristics.
Updated Figure 17: Typical application with a 32.768 kHz crystal.
Updated Table 28: HSE oscillator characteristics.
Updated Section 6.3.12: Electrical sensitivity characteristics (title).
Updated Section 6.3.13: I/O current injection characteristics. Updated
Table 49: I/O current injection susceptibility and added footnote.
Updated conditions in Table 51: Output voltage characteristics.
Updated Section 6.3.15: NRST pin characteristics.Updated Figure 27:
Recommended NRST pin protection. Updated Table 53: NRST pin
characteristics.
Table 82. Document revision history (continued)
Date
Revision
Changes



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