STM32L151VD datasheet(153/154 Pages) STMICROELECTRONICS

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DocID022027 Rev 11

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STM32L151xD STM32L152xD

Revision History

153

02-Apr-2015

Updated Section 7: Package information with new package paragraph

structure (paragraph title and heading level) and adding note for device

orientation versus pin 1/ ball A1 identifier.

Updated Figure 42: LQFP144, 20 x 20 mm, 144-pin low-profile quad

flat package top view example and Figure 45: LQFP100, 14 x 14 mm,

100-pin low-profile quad flat package top view example removing gate

mark.

Added Figure 53: WLCSP64, 0.4 mm pitch wafer level chip scale

package recommended footprint and Table 79: WLCSP64, 0.4 mm

pitch package recommended PCB design rules.

Updated Table 8: STM32L151xD and STM32L152xD pin definitions

ADC inputs.

Updated Table 16: Embedded internal reference voltage temperature

coefficient at 100ppm/°C.

and table footnote 3: “guaranteed by design” changed by “guaranteed

by characterization results”.

Updated Table 72: Comparator 2 characteristics new maximum

threshold voltage temperature coefficient at 100ppm/°C.

10-Feb-2016

Updated cover page putting eight SPIs in the peripheral

communication interface list.

Updated Table 2: Ultra-low-power STM32L151xD and STM32L152xD

device features and peripheral counts SPI and I2S lines.

Updated Table 47: ESD absolute maximum ratings CDM class II by

class III.

Updated all the notes, removing ‘not tested in production’.

Updated Table 10: Voltage characteristics adding note about VREF-

pin.

Updated Table 5: Functionalities depending on the working mode (from

Run/active down to standby) LSI and LSE functionalities putting “Y” in

Standby mode.

Table 82. Document revision history (continued)

Date

Revision

Changes

STM32L151VD Datasheet(PDF) 153 Page - STMicroelectronics