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SPC563M60X Datasheet(PDF) 125 Page - STMicroelectronics

Part # SPC563M60X
Description  32-bit Power Architecture based MCU for automotive powertrain applications
PDF  128 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC563M60X Datasheet(HTML) 125 Page - STMicroelectronics

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SPC563M64x, SPC563M60x
Revision history
127
15-Apr-2010
5
(cont.)
Updates to eQADC conversion specifications (operating):
– Offset error without calibration max value is 160 (was 100)
– Full scale gain error without calibration min value is –160 (was –120)
Changes to Platform Flash controller electrical characteristics:
– APC, RWSC, WWSC settings vs. frequency of operation table updated
Changes to Flash memory specifications:
–TBKPRG 64 KB specification removed (not present in this device)
–T64kpperase specification added
– Flash module life P/E spec for 32 Kbyte blocks also applies to 64 Kbyte blocks
Pad AC specifications (3.3 V) table updated
LBGA208 package is no longer offered for 1024 KB (SPC563M60) devices
19-Apr-2010
6
Updated “Core voltage regulator controller external components preferred configuration”
figure.
– Clarification added to note: Emitter and collector capacitors (6.8 µF and 10 µF) should
be matched (same type) and ESR should be lower than 200 mW. (Added emphasis
that only 6.8
F emitter capacitors need to be matched with collector capacitor.
– 220 µF emitter capacitors changed to 220 nF.
03-Feb-2011
7
No specification or product information changes:
– Mechanical outline drawings section renamed to “Packages” and restructured.
– ECOPACK section added.
04-Feb-2011
8
Removed the 208 BGA package from the device-summary table.
Revised the “PMC Operating conditions and external regulators supply voltage” table.
Revised the “PMC electrical characteristics” table.
Revised the pad AC specifications.
Revised the “DC electrical specifications” table.
Revised the “DSPI LVDS pad specification” table:
Revised the “PLLMRFM electrical specifications” table.
Change to “Temperature sensor electrical characteristics” table:
– Accuracy is guaranteed by production test
Revised the “eQADC conversion specifications (operating)” table.
Changes to “Calibration bus operation timing” table:
– CLKOUT period is guaranteed by production test. All other parameters are
guaranteed by design
Changes to “Program and erase specifications” table in “Flash memory electrical
characteristics” section.
– Deleted Bank Program (512KB) (TBKPRG) parameter
– TYP P/E values added for 32- and 64 KB blocks and for 128 KB blocks.
Changes to Recommended operating characteristics for external power transistor:
– VCESAT should be between 200 and 600 mV
– VBE should be 0.4V to 1.0V
Changes to “APC, RWSC, WWSC settings vs. frequency of operation” table in Platform
Flash controller electrical characteristics section:
– Target Max Frequency of 60 MHz changed to 64 MHz.
Removed footnote 8 from Vddeh in Maximum ratings.
Table 45. Document revision history (continued)
Date
Revision
Changes



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