STV0056 datasheet(16/26 Pages) STMICROELECTRONICS

16 / 26 page

REF 2.4V

AMPLK L

AMPLK R

10k

Ω

160

µA

AGC L

AGC R

To VCA

Figure 23

Vbg 1.2V

REF (2.4V)

10k

Ω

10k

Ω

GND 0V

400

µA

Figure 24

REF 2.4V

LEVEL R

LEVEL L

50k

Ω

100

µA

49k

Ω

49k

Ω

Audio

Figure 25

REF 2.4V

PK IN R

PK IN L

67k

Ω

100

µA

To Peak Det

Figure 26

V 12V

V GND

Video Pads

DD 5V

GND 5V

Digital Pads

205

Ω

A GND L

A 12V

A GND R

Audio Pads

BIP

12V

Substrate

DZPN1

BIP 10vpl

Vpp

Vmm

Figure 27

PIN INTERNAL CIRCUITRY (continued)

AMPLK L, AMPLK R, AGC L, AGC R

I2 and I1 from the amplitude detecting mixer.

VREF

The 400

µA source is off during stand-by mode.

LEVEL L, LEVEL R

PK IN L, PK IN R

V 12V

Doubled bonded (two bond wires and two pads for

one package pin) :

- One pad is connected to all of the 12V ESD and

video guard rings.

- The second pad is connected to power up the

video block.

VGND

Doubled bonded :

- One pad is connected to power-up all of the video

mux and I/O.

- The second pad is only as a low noise GND for

the video input.

VDD 5V, GND 5V

Connected to XTL oscillator and the bulk of the

CMOS logic and 5V ESD.

A GND

Doubled bonded :

- One pad connected to the left VCO, dividers,

mixers and guard ring. the guard connection is

star connected directly to the pad.

- The second pad is connected to both AGC amps

and the deemphasis amplifiers, frequency syn-

thesis and FM deviation selection circuit for both

channels.

A 12V

Doubled bonded :

- One pad connected to the ESD and guard ring.

- The second pad is connected to the main power

for all of the audio parts.

A GND R

Boubled bonded :

- One pad connected to the right VCO, dividers,

mixers and guard ring. The guard connection is

star connected directly to the pad.

- The second pad is connected to the bias block,

audio noise reduction, volume, mux and ESD.

A third bond wire on this pin is connected directly

to the die pad (substrate).

STV0056A

16/26

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