DSPIC33FJ32GS608 datasheet(406/416 Pages) MICROCHIP

406 / 416 page

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

DS70591B-page 406

Preliminary

 2009 Microchip Technology Inc.

Section 27.0 “Electrical

Characteristics”

Updated the Absolute Maximum Ratings for high temperature and added

Note 4.

Updated all Operating Current (IDD) Typical and Max values in Table 27-5.

Updated all Idle Current (IIDLE) Typical and Max values in Table 27-6.

Updated all Power-Down Current (IPD) Typical and Max values in

Table 27-7.

Updated all Doze Current (IDOZE) Typical and Max values in Table 27-8.

Updated the Typ and Max values for parameter D150 and removed

parameters DI26, DI28, and DI29 from the I/O Pin Input Specifications

(see Table 27-9).

Updated the Typ and Max values for parameter DO10 and DO27 and the

Min and Typ values for parameter DO20 in the I/O Pin Output

Specifications (see Table 27-10).

Added parameter numbers to the Auxiliary PLL Clock Timing

Specifications (see Table 27-18).

Added parameters numbers and updated the Internal RC Accuracy Min,

Typ, and Max values (see Table 27-19 and Table 27-20).

Added parameter numbers, Note 2, updated the Min and Typ parameter

values for MP31 and MP32, and removed the conditions for MP10 and

MP11 in the High-Speed PWM Module Timing Requirements (see

Table 27-29).

Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics

(see Figure 27-14).

Added parameter IM51 to the I2Cx Bus Data Timing Requirements

(Master Mode) (see Table 27-34).

Updated the Max value for parameter AD33 in the 10-bit High-Speed A/D

Module Specifications (see Table 27-36).

Updated the titles and added parameter numbers to the Comparator and

DAC Module Specifications (see Table 27-38 and Table 27-39) and the

DAC Output Buffer Specifications (see Table 27-40).

TABLE B-1:

MAJOR SECTION UPDATES (CONTINUED)

Section Name

Update Description

dsPIC33FJ32GS608 Datasheet(PDF) 406 Page - Microchip Technology