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MF1S5009DA4 Datasheet(PDF) 25 Page - NXP Semiconductors |
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MF1S5009DA4 Datasheet(HTML) 25 Page - NXP Semiconductors |
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25 / 32 page ![]() MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3 — 27 July 2010 189131 25 of 32 NXP Semiconductors MF1S5009 Mainstream contactless smart card IC 12. Limiting values [1] Stresses above one or more of the limiting values may cause permanent damage to the device [2] Exposure to limiting values for extended periods may affect device reliability [3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k Ω 13. Characteristics [1] Stresses above one or more of the values may cause permanent damage to the device. [2] Exposure to limiting values for extended periods may affect device reliability. [3] LCR meter, Tamb = 22 °C, fi = 13.56 MHz, 2.8 V RMS. Table 20. MIFARE Transfer command Name Code Description Length Cmd B0h Write value into destination block 1 byte Addr - MIFARE destination block address (00h to FFh) 1 byte CRC - CRC according to Ref. 4 2 bytes NAK see Table 9 see Section 10.3 4-bit Table 21. MIFARE Transfer timing These times exclude the end of communication of the PCD. TACK min TACK max TNAK min TNAK max TTimeOut Transfer 71 μsT TimeOut 71 μsT TimeOut 10 ms Table 22. Limiting values [1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit II input current - 30 mA Ptot/pack total power dissipation per package - 200 mW Tstg storage temperature −55 +125 °C Tamb ambient temperature −25 +70 °C VESD electrostatic discharge voltage [3] 2- kV Ilu latch-up current ±100 - mA Table 23. Characteristics [1][2] Symbol Parameter Conditions Min Typ Max Unit Ci input capacitance [3] 15.0 17.0 19.0 pF fi input frequency - 13.56 - MHz EEPROM characteristics tret retention time Tamb = 22 °C 10 - - year Nendu(W) write endurance Tamb = 22 °C 100000 200000 - cycle |
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