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MF1S5009DA4 Datasheet(PDF) 6 Page - NXP Semiconductors

Part # MF1S5009DA4
Description  Mainstream contactless smart card IC for fast and easy solution development
PDF  32 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MF1S5009DA4 Datasheet(HTML) 6 Page - NXP Semiconductors

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MF1S5009
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131
6 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
8.
Chip orientation and bond pad locations
(1) The air gap may vary due to varying foil expansion
(2) Measured from outer sealring edge (see detail)
All dimensions in
μm
Fig 4.
Chip orientation and bond pad locations
001aam201
Bump size
LA, LB
VSS, TP1, TP2
Chip Step
69
58
1231(1)
69
x (
μm)
y (
μm)
58
1280(1)
LA
TP1
TP2
VSS
LB
typ. 15.0(1)
min. 5.0
typ. 36.4(1)(2)
min. 26.4
typ. 15.0(1)
min. 5.0
1071.0(2)
typ. 36.4(1)(2)
min. 26.4
Y
X
1070.0(2)
52.3(2)
51.3(2)
239.2(2)
368.7(2)
556.6(2)
807.7(2)
1231.0(1)
1280.0(1)
52.9(2)
Dimensions in
μm



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