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MF1S5009DA4 Datasheet(PDF) 26 Page - NXP Semiconductors |
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MF1S5009DA4 Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 32 page  MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3 — 27 July 2010 189131 26 of 32 NXP Semiconductors MF1S5009 Mainstream contactless smart card IC 14. Package outline Fig 20. Package outline SOT500-2 UNIT D REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 35.05 34.95 For unspecified dimensions see PLLMC-drawing given in the subpackage code. DIMENSIONS (mm are the original dimensions) SOT500-2 03-09-17 06-05-22 - - - - - - - - - PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-2 A(1) max. 0.33 0 10 20 mm scale A detail X X Note 1. Total package thickness, exclusive punching burr. D |
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