MC68HC705P9CS datasheet(151/160 Pages) FREESCALE

151 / 160 page

MC68HC705P9 — Rev. 4.0

Technical Data

MOTOROLA

Ordering Information

151

Technical Data — MC68HC705P9

Section 14. Ordering Information

14.1 Contents

14.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

14.3

MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .151

14.2 Introduction

This section contains ordering numbers for the MC68HC705P9.

14.3 MC Order Numbers

Table 14-1. Order Numbers

Package

Type

Case

Outline

Count

Operating

Temperature

Order Number

Plastic DIP(1)

1. DIP = dual in-line package

710

0 to +70

°C

–40 to +85

°C

–40 to +105

°C

–40 to +125

°C

MC68HC705P9P

MC68HC705P9CP

MC68HC705P9VP

MC68HC705P9MP

SOIC(2)

2. SOIC = small outline integrated circuit

733

0 to +70

°C

–40 to +85

°C

–40 to +105

°C

–40 to +125

°C

MC68HC705P9DW

MC68HC705P9CDW

MC68HC705P9VDW

MC68HC705P9MDW

CERDIP(3)

3. CERDIP = ceramic DIP

751F

0 to +70

°C

–40 to +85

°C

–40 to +105

°C

–40 to +125

°C

MC68HC705P9S

MC68HC705P9CS

MC68HC705P9VS

MC68HC705P9MS

Freescale Semiconductor, Inc.

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