MPC5673F datasheet(24/132 Pages) FREESCALE

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MPC5674F Microcontroller Data Sheet, Rev. 6

Electrical Characteristics

Freescale Semiconductor

where:

TT = thermocouple temperature on top of the package (

oC)

JT = thermal characterization parameter (

oC/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied

to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm. of wire extending from the

junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects

of the thermocouple wire.

References:

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or

303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

•

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.

•

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic

Packaging and Production, pp. 53-58, March 1998.

•

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.

4.3

EMI (Electromagnetic Interference) Characteristics

To find application notes that provide guidance on designing your system to minimize interference from radiated emissions, go

to www.freescale.com and perform a keyword search for “radiated emissions.” The following tables list the values of the

device's radiated emissions operating behaviors.

Table 7. EMC Radiated Emissions Operating Behaviors: 416 BGA

Symbol

Description

Conditions

fOSC

fSYS

Frequency

band (MHz)

Level

(max.)

Unit Notes

VRE_TEM

Radiated emissions,

electric field and

magnetic field

VDD = 1.2 V

VDDE = 3.3 V

VDDEH = 5 V

TA = 25 °C

416 BGA

EBI off

CLK on

FM off

40 MHz crystal

264 MHz

(fEBI_CAL =66

MHz)

0.15–50

μV

50–150

150–500

500–1000

IEC and SAE level

—

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