Advance Data Sheet: iAF Series – Non-isolated SMT Power Module

©2011 TDK Innoveta Inc.

iAF12_Full_Datasheet_08152011.doc 8/16/2011

(877) 498-0099

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Soldering Information:

iAF surface mountable power modules are intended to be compatible with standard surface mount component

soldering processes and either hand placed or automatically picked and placed. The figure below shows the position

for vacuum pick up. The maximum weight of the power module is 5.5g (0.194 oz.). Improper handling or cleaning

processes can adversely affect the appearance, testability, and reliability of the power modules. The iAF product is a

moisture sensitivity level 2 device. Contact TDK Innoveta technical support for guidance regarding proper handling,

cleaning, and soldering of TDK Innoveta’s power modules.

Reflow Soldering

The iAF platform is an open frame power module manufactured with SMT (surface mount technology). Due to the high

thermal mass of the power module and sensitivity to heat of some SMT components, extra caution should be taken

when reflow soldering. Failure to follow the reflow soldering guidelines described below may result in permanent

damage and/or affect performance of the power modules.

The iAF power modules can be soldered using natural convection, forced convection, IR (radiant infrared), and

convection/IR reflow technologies. The module should be thermally characterized in its application to develop a

temperature profile. Thermal couples should be mounted to terminal 1 and terminal 4 and be monitored. The

temperatures should be maintained below 260 degrees. Oven temperature and conveyer belt speeds should be

controlled to ensure these limits are not exceeded. In most manufacturing processes, the solder paste required to form

a reliable connection can be applied with a standard 6 mil stencil.

Recommended Reflow Profile

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Reflow Time (seconds)

Liquidus Line

iAF Power Module suggested reflow-soldering profile