LM26480SQ-BFSLASHNOPB datasheet(6/37 Pages) TI1

6 / 37 page

LM26480

SNVS543I – JANUARY 2008 – REVISED MAY 2013

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Operating Ratings: Bucks

(1) (2) (3)

VIN

2.8V to 5.5V

VEN

0 to (VIN + 0.3V)

Junction Temperature (TJ) Range

–40°C to +125°C

Ambient Temperature (TA) Range

(4)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For performance limits and

associated test conditions, see the Electrical Characteristics.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.

(4)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

Thermal Properties

(1) (2) (3)

Junction-to-Ambient Thermal Resistance (

θJA), RTW0024A

34.1°C/W

(1)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.)

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX). See Application Notes.

(3)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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