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ADS8322Y/2K Datasheet(PDF) 12 Page - Texas Instruments |
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ADS8322Y/2K Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 19 page ![]() ADS8322 SBAS215A – JULY 2001 – REVISED JANUARY 2010 www.ti.com The AGND and DGND pins should be connected to a As with the GND connections, VDD should be clean ground point. In all cases, this point should be connected to a +5V power supply plane, or trace, that the analog ground. Avoid connections which are too is separate from the connection for digital logic until close to the grounding point of a microcontroller or they are connected at the power entry point. Power to digital signal processor. If required, run a ground the ADS8322 should be clean and well-bypassed. A trace directly from the converter to the power supply 0.1 μF ceramic bypass capacitor should be placed as entry point. The ideal layout will include an analog close to the device as possible. In addition, a 1 μF to ground plane dedicated to the converter and 10 μF capacitor is recommended. If needed, an even associated analog circuitry. larger capacitor and a 5 Ω or 10Ω series resistor may be used to low-pass filter a noisy supply. In some situations, additional bypassing may be required, such as a 100 μF electrolytic capacitor, or even a Pi filter made up of inductors and capacitors—all designed to essentially low-pass filter the +5V supply, removing the high-frequency noise. white space here REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (July, 2001) to Revision A Page • Updated document format to current standards ................................................................................................................... 1 • Deleted lead temperature specifications from Absolute Maximum Ratings table ................................................................ 2 • Changed acquisition time specification from .4 μs (max) to 350ns (min) .............................................................................. 3 • Changed acquisition time specification from .4 μs (max) to 350ns (min) .............................................................................. 6 • Added Figure 12, Linearity Error and Differential Linearity Error vs Code ........................................................................... 8 12 Submit Documentation Feedback Copyright © 2001–2010, Texas Instruments Incorporated Product Folder Link(s): ADS8322 |
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