LM3560TLXSLASHNOPB datasheet(3/48 Pages) TI1

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LM3560

www.ti.com

SNOSB43B – SEPTEMBER 2011 – REVISED AUGUST 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

VIN, VSW, VOUT

−0.3V to 6V

VSCL, VSDA, VHWEN, VSTROBE, VTX1, VTX2, VLED1, VLED2, VLED1/NTC

−0.3V to the lesser of (VIN+0.3V) or 6.0V

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Soldering)

(5)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For performance limits and

associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and

disengages at TJ=+135°C (typ.). Thermal shutdown is specified by design.

(5)

For detailed soldering specifications and information, see Application Note AN1112 DSBGA Wafer Level chip Scale Package.

OPERATING RATINGS

(1) (2)

VIN

2.5V to 5.5V

Junction Temperature (TJ)

−40°C to +125°C

Ambient Temperature (TA)

(3)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For performance limits and

associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

+125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

THERMAL PROPERTIES

Thermal Junction-to-Ambient Resistance (

θJA)

(1)

50.4°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array

of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5

oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.

ELECTRICAL CHARACTERISTICS

(1) (2)

Limits in standard typeface are for TA = +25°C. Limits in boldface type apply over the full operating ambient temperature

range (

−40°C ≤ TA ≤ +85°C). Unless otherwise specified, VIN = 3.6V, VHWEN = VIN.

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

Current Source Specifications

−40°C ≤ TA ≤

1000mA Flash

-5%

+5%

+85°C

Current Setting, per

2000

ILED1+ILED2,

current source

Current Source

TA = +25°C

−3.5%

+3.5%

ILED

VOUT = 4.5V,

Accuracy

31.25mA Torch

3.0V

≤ VIN ≤ 4.2V

−40°C ≤ TA ≤

Current Setting, per

−10%

62.5

+10%

+85°C

current source

VOUT -

Current Source

ILED = 2A, (ILED1 + ILED2)

300

VLED1/2

Regulation Voltage

VOUT = 4.5V

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Min and Max limits are specified by design, test, or statistical analysis. Typical (Typ) numbers represent the most likely norm. Unless

otherwise specified, conditions for typical specifications are: VIN = 3.6V and TA = +25°C.

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