TMS320F241FN datasheet(73/122 Pages) TI1

73 / 122 page

TMS320F243, TMS320F241

DSP CONTROLLERS

SPRS064D − DECEMBER 1997 − REVISED FEBRUARY 2006

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

device and development-support tool nomenclature (continued)

Support tool development evolutionary flow:

TMDX

Development support product that has not yet completed Texas Instruments internal qualification

testing

TMDS

Fully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

“Developmental product is intended for internal evaluation purposes.”

TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability

of the device have been demonstrated fully. TI’s standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system because their

expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type

(for example, FN, PG, and PGE) and temperature range (for example, L). Figure 16 provides a legend for

reading the complete device name for any TMS320x2xx family member.

PREFIX

TEMPERATURE RANGE (DEFAULT: 0

°C TO 70°C)

TMS 320

243

PGE (L)

TMX = experimental device

TMP = prototype device

TMS = qualified device

DEVICE FAMILY

320 = TMS320

t DSP Family

TECHNOLOGY

L= 0

°C to 70°C

A= − 40

°C to 85°C

S= − 40

°C to 125°C

PACKAGE TYPE†

FN = 68-pin PLCC

PG = 64-pin plastic QFP

PGE = 144-pin plastic LQFP

C = CMOS

E = CMOS EPROM

F = Flash EEPROM

LC = Low-voltage CMOS (3.3 V)

VC = Low-voltage CMOS (3 V)

DEVICE

24x DSP

240

241

242

243‡

† PLCC = Plastic J-Leaded Chip Carrier

QFP

Quad Flatpack

LQFP =

Low-Profile Quad Flatpack

‡ The package dimensions of the 243 device correspond to the LQFP package. This device was stated to be in QFP packaging

in previous data sheets. The package dimensions have not changed; only the package designation has changed.

Figure 16. TMS320x24x DSP Device Nomenclature

TMS320F241FN Datasheet(PDF) 73 Page - Texas Instruments

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