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LIS2HH12 Datasheet(PDF) 15 Page - STMicroelectronics

Part # LIS2HH12
Description  Embedded temperature sensor
PDF  47 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

LIS2HH12 Datasheet(HTML) 15 Page - STMicroelectronics

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DocID025344 Rev 5
15/47
LIS2HH12
Mechanical and electrical specifications
47
2.6
Terminology and functionality
Terminology
2.6.1
Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the Earth, noting the output value, rotating
the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and time. The sensitivity tolerance describes the
range of sensitivities of a large population of sensors.
2.6.2
Zero-g level
Zero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal
output signal if no acceleration is present. A sensor in a steady state on a horizontal surface
will measure 0 g on the X-axis and 0 g on the Y-axis whereas the Z-axis will measure 1 g.
The output is ideally in the middle of the dynamic range of the sensor (content of OUT
registers 00h, data expressed as two’s complement number). A deviation from ideal value in
this case is called Zero-g offset. Offset is to some extent a result of stress to the MEMS
sensor and therefore the offset can slightly change after mounting the sensor onto a printed
circuit board or exposing it to extensive mechanical stress. Offset changes little over
temperature, see “Zero-g level change vs. temperature”. The Zero-g level tolerance (TyOff)
describes the standard deviation of the range of Zero-g levels of a population of sensors.
Functionality
2.6.3
Self-test
The self-test allows checking the sensor functionality without moving it. The self-test
function is off when the self-test bits (ST) are programmed to ‘00‘. When the self-test bits are
changed, an actuation force is applied to the sensor, simulating a definite input acceleration.
In this case the sensor outputs will exhibit a change in their DC levels which are related to
the selected full scale through the device sensitivity. When the self-test is activated, the
device output level is given by the algebraic sum of the signals produced by the acceleration
acting on the sensor and by the electrostatic test-force. If the output signals change within
the amplitude specified in Table 3, then the sensor is working properly and the parameters
of the interface chip are within the defined specifications.
2.7
Sensing element
A proprietary process is used to create a surface micromachined accelerometer. The
technology allows processing suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. In order to be compatible with the traditional packaging techniques, a cap is
placed on top of the sensing element to avoid blocking the moving parts during the molding
phase of the plastic encapsulation.



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