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KMA310 Datasheet(PDF) 63 Page - NXP Semiconductors |
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KMA310 Datasheet(HTML) 63 Page - NXP Semiconductors |
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63 / 71 page  NXP Semiconductors KMA310 Programmable angle sensor IC KMA310 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved. Product data sheet Rev. 3 — 27 February 2019 63 / 71 24 Handling information 008aaa261 R 0.25 min R 0.25 min 0.7(1) 1.4(1) 0.7(1) (2) (2) Dimensions in mm 1. No bending allowed. 2. Plastic body and interface plastic body - leads: application of bending forces not allowed. Figure 32. Bending recommendation 25 Soldering The solderability qualification is according to AEC-Q100 Rev-H. Recommended soldering process for leaded devices is wave soldering. The maximum soldering temperature is 260 °C for maximum 5 s. Device terminals are compatible with laser and electrical welding. The package is reflow capable. . |
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