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MXT1664T3-ATESSQTP Datasheet(PDF) 63 Page - Microchip Technology |
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MXT1664T3-ATESSQTP Datasheet(HTML) 63 Page - Microchip Technology |
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63 / 98 page ![]() MXT1664T3 2.0 2018 Microchip Technology Inc. DS40002054A-page 63 • Try to keep as many signals as possible on the inside layers of the board. If suitable ground flood fills are used on the top and bottom layers, these will provide a good level of screening for noisy signals, both into and out of the PCB. • Ensure that the on-board regulators have sufficient tracking around and underneath the devices to act as a heatsink. This heatsink will normally be connected to the 0 V or ground supply pin. Increasing the width of the copper tracking to any of the device pins will aid in removing heat. There should be no solder mask over the copper track underneath the body of the regulators. • Ensure that the decoupling capacitors, especially high capacity ceramic type, have the requisite low ESR, ESL and good stability/temperature properties. Refer to the regulator manufacturer’s datasheet for more information. |
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