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ZSSC3240CC1B Datasheet(PDF) 6 Page - Renesas Technology Corp |
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ZSSC3240CC1B Datasheet(HTML) 6 Page - Renesas Technology Corp |
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6 / 64 page ![]() ZSSC3240 Datasheet Nov.27.20 Page 6 1. Pin Assignments The ZSSC324x is available as 8-inch wafers and in a 24-QFN package. Detailed information about die and wafers is available on request (see last page for contact information). ZSSC324x 1 6 12 18 24 EOC VSSB SS FB AOUT / OWI1 VDDB IDT-Test IDT-Test VSS INP OWI2in INN 2 3 4 5 11 7 8 9 10 17 16 15 14 13 23 22 21 20 19 25 : QFN-bottom plate, Exposed PAD. Figure 1. Pin Assignments for 4 4 mm2 24-QFN Package – Top View VSSB LDOctrl INN VDDB Text AOUT / OWI1 FB OWI2in EOC RESQ MOSI / SDA SCLK / SCL INP MISO IDT-Test SS Seal Ring IC Core IDT-Test IDT-Test VDD VSS Figure 2. Pin (Pad) Assignments for Bare Die |
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