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ZSSC3240CC1B Datasheet(PDF) 10 Page - Renesas Technology Corp

Part # ZSSC3240CC1B
Description  Sensor Signal Conditioner IC for Resistive Sensors
PDF  64 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ZSSC3240CC1B Datasheet(HTML) 10 Page - Renesas Technology Corp

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ZSSC3240
Datasheet
Nov.27.20
Page 10
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
ErrA,IC
ZSSC3240 accuracy
error
Accuracy error with an ideally linear
sensor (in temperature and measurand)
–
–
0.01
% FSO
Vioffsc
Correctable (in PGA),
absolute, differential input
offset
Programmable in 1mV steps; accuracy:
±5% referenced to nominal setup
-15
0
15
mV
Δ
ADC,c
Correctable (in ADC),
relative, differential input
offset
Percentage of sensor signal offset
versus maximum sensor signal
0
–
98
%
Input
VINP, VINN
Absolute sensor input
Voltages at INP and INN pin; resulting
minimum/maximum differential voltages:
-700mV < VINdiff < 700mV
0.5
–
1.20
V
VTEXT
External temperature
diode or RTD input range
At TEXT pin
0.5
–
1.25
V
RSENSOR
External sensor (bridge)
resistance
VDDB = 1.75V
0.5
–
60
kΩ
For 4mA to 20mA current loop output
1.6
–
60
kΩ
|VDIFFin|
Differential input signal
range
Referenced to sensor supply (VDDAint);
leading to full scale analog excitation
2.6
50
700
mV
Diagnostics
Ropen
Sensor connection loss;
i.e., open threshold
INP vs. INN
70
–
–
kΩ
Rshort
Sensor connection short
threshold
INP vs. INN; TEXT vs. VDDB
–
–
100
Ω
Vs,valid
Valid sensor input signal
Beyond Vs,valid, sensor connection checks
(such as in-range, etc.) signalize
Diagnostic FAULTs
0.44
–
1.31
V
Power-Up
tSTA1
Start-up Time
VDD ramp up to interface communication
–
–
2
ms
tSTA2
VDD ramp up to analog operation
–
–
2.5
ms
tWUP1
Wake-up Time
Sleep to Active State interface
communication
–
2
10
µs
tWUP2
Sleep to Active State analog operation
–
–
2
ms
Oscillator
fCLK
Internal oscillator
frequency
5.9
6.0
6.1
MHz
Temperature Sensor(s)
rTemp
Internal temperature
sensor resolution
Setup: ADTTsens,int = 13-bit
12
35
–
Counts/K
Rt, Rt'
Internal low TC [f]
top/bottom resistance for
external temperature
Programmable with internal_rt and
extra_rt;
applied if temp_source
є {010; 110} (see
section 6.2.4)
1.34
–
40
kΩ
Interface and Memory
fC,SPI
SPI clock frequency
0.05
1
12
MHz
fC,I2C
I2C clock frequency
-
–
3.4
MHz
CDOWI
OWI data rate
0.33
–
10
kBit/s
tPROG
NVM program time
Programming time per 16-bit word
–
3
7
ms
nNVM
NVM endurance
Number of reprogramming cycles
1000
10000
–
Numeric
tRET,NVM
Data retention
10
–
–
Years
[a]
Referenced to nominal value. Relative errors are typically < 1% for sensor bias current setups > 20µA.
[b]
PSRR = 20·log10(VDD/VDDB): will be improved when applying external filter elements at VDD and/or also using an external JFET
regulator.
[c]
This parameter must be taken into account if automatic common mode regulation in the PGA is switched off (pga_en_shift; see
section 6.2.1) and a non-symmetric sensor supply and input to the PGA ADC path have been configured.
[d]
There are several setups and parameters that allow optimizing and maximizing the output update rate; e.g., ADC and DAC
resolutions, configurations for the measurement sequence, usage of the internal or an external temperature sensor.
[e]
Vioffsc and ΔADC,c can be arbitrarily set up and combined. They work independently on each other.
[f]
Typical residual temperature variation of voltage across Rt, Rt': 10ppm/K; maximum deviation: 150ppm/K at
40kΩ and >100°C, all other setups and conditions < 60ppm/K.
[g]
ENOB = log2( 2
rADC / 3
Noise ) with, for example rADC[Bit] = 24.



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