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MPC8533EVJALGA Datasheet(PDF) 75 Page - NXP Semiconductors

Part # MPC8533EVJALGA
Description  MPC8533E PowerQUICC III Integrated Processor Hardware Specifications
PDF  112 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC8533EVJALGA Datasheet(HTML) 75 Page - NXP Semiconductors

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MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
75
PCI Express
The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the
TX UI.
NOTE
The reference impedance for return loss measurements is 50
Ω to ground for
both the D+ and D– line (that is, as measured by a vector network analyzer
with 50-
Ω probes, see Figure 53). Note that the series capacitors, CTX, are
optional for the return loss measurement.
Figure 53. Minimum Receiver Eye Timing and Voltage Compliance Specification
17.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within
0.2 inches of the package pins, into a test/measurement load shown in Figure 54.
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
Figure 54. Compliance Test/Measurement Load
VRX-DIFF = 0 mV
(D+ D– Crossing Point)
VRX-DIFF = 0 mV
(D+ D– Crossing Point)
VRX-DIFFp-p-MIN > 175 mV
0.4 UI = TRX-EYE-MIN
TX
Silicon
+ Package
C = CTX
C = CTX
R = 50
Ω
R = 50
Ω
D+ Package
Pin
D– Package
Pin
D+ Package
Pin



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