MPC8533EVJALGA datasheet(93/112 Pages) NXP

Part #	MPC8533EVJALGA

Description	MPC8533E PowerQUICC III Integrated Processor Hardware Specifications

PDF	112 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8

Freescale Semiconductor

Thermal

Figure 56. System Level Thermal Model for MPC8533E (Not to Scale)

The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer

for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under

the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case,

the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in

the package library file will suffice for these simulations. The user will need to determine the optimal grid

for their specific case.

Solder and Air (29

× 29 × 0.58 mm)

0.034

W/m•K

0.034

12.1

Table 67. MPC8533EThermal Model (continued)

Conductivity

Value

Units

Bump Underfill

Section A-A

Top View

Die

Substrate

Solder/Air

MPC8533EVJALGA Datasheet(PDF) 93 Page - NXP Semiconductors