MPC8533EVJALGA datasheet(77/112 Pages) NXP

Part #	MPC8533EVJALGA

Description	MPC8533E PowerQUICC III Integrated Processor Hardware Specifications

PDF	112 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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77 / 112 page

MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8

Freescale Semiconductor

Package Description

18.2

Mechanical Dimensions of the MPC8533E FC-PBGA

Figure 55 shows the mechanical dimensions and bottom surface nomenclature of the MPC8533E,

783 FC-PBGA package without a lid.

Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature

of the MPC8533E FC-PBGA without a Lid

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.

7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.

MPC8533EVJALGA Datasheet(PDF) 77 Page - NXP Semiconductors