SPC58NH84C3 datasheet(127/147 Pages) STMICROELECTRONICS

127 / 147 page

DS12304 Rev 5

127/147

SPC58EHx, SPC58NHx

Package information

131

5.5

Package thermal characteristics

The following tables describe the thermal characteristics of the device. The parameters in

this chapter have been evaluated by considering the device consumption configuration

reported in the Section 4.7: Device consumption.

5.5.1

eTQFP144

5.5.2

LQFP176

Table 70. Thermal characteristics for 144 exposed pad eTQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2) Four layer board (2s2p)

21.3

°C/W

RθJB

Junction-to-board(3)

—8.1

°C/W

RθJCtop

Junction-to-case top(4)

—5.4

°C/W

RθJCbottom CC D

Junction-to-case bottom(5)

—1

°C/W

ΨJT

Junction-to-package top(6)

Natural convection

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 71. Thermal characteristics for 176 exposed pad LQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2) Four layer board (2s2p)

20.6

°C/W

RθJB

Junction-to-board(3)

—

8.6

°C/W

RθJCtop

Junction-to-case top(4)

—

7.2

°C/W

RθJCbottom CC D

Junction-to-case bottom(5)

—1

°C/W

ΨJT

Junction-to-package top(6)

Natural convection

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

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