SPC58NH84C3 datasheet(128/147 Pages) STMICROELECTRONICS

128 / 147 page

Package information

SPC58EHx, SPC58NHx

128/147

DS12304 Rev 5

5.5.3

FPBGA302

5.5.4

FPBGA386

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 72. Thermal characteristics for 302-pin FPBGA

Symbol

Parameter(1)

Conditions

Value(2)

Unit

ThetaJ-A

D Junction-to-Ambient, Natural Convection(3)

2s2p board

21.2

°C/W

ThetaJ-B

Junction-to-board(4)

Ring cold plate

2s2p board

9.6

°C/W

ThetaJ-C

Junction-to-case top(5)

Top cold plate

1s board

6.1

°C/W

ΨJ-B

Junction-to-board(6)

Operating conditions

9.4

°C/W

ΨJ-C

Junction-to-case top

Operating conditions

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. These values are preliminary, therefore they are subject to change.

3. Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

6. Thermal characterization parameter

Table 73. Thermal characteristics for 386-pin FPBGA

Symbol

Parameter(1)

Conditions

Value

Unit

ThetaJ-A

D Junction-to-Ambient, Natural Convection(2)

2s2p board

19.9

°C/W

ThetaJ-B

Junction-to-board(3)

Ring cold plate

2s2p board

9.2

°C/W

ThetaJ-C

Junction-to-case top(4)

Top cold plate

1s board

5.7

°C/W

ΨJ-B

Junction-to-board(5)

Operating conditions

°C/W

ΨJ-C

Junction-to-case top

Operating conditions

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal characterization parameter

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