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R5F5671CDDFM Datasheet(PDF) 88 Page - Renesas Technology Corp |
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R5F5671CDDFM Datasheet(HTML) 88 Page - Renesas Technology Corp |
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88 / 178 page ![]() R01DS0373EJ0110 Rev.1.10 Page 88 of 178 Apr 15, 2022 RX671 Group 2. Electrical Characteristics Note: The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of the board. For details, refer to the JEDEC standards. Note 1. This value applies when the exposed die pad for this purpose is connected to VSS. Table 2.10 Thermal Resistance Value (Reference) Item Package Symbol Max. Unit Test Conditions Thermal resistance 144-pin LFQFP (PLQP0144KA-B) θja 48.4 °C/W JESD51-2 and JESD51-7 compliant 100-pin LFQFP (PLQP0100KB-B) 51.7 64-pin LFQFP (PLQP0064KB-C) 51.2 48-pin HWQFN (PWQN0048KC-A) 19.1*1 145-pin TFLGA (PTLG0145JC-A) 30.9 JESD51-2 and JESD51-9 compliant 145-pin TFLGA (PTLG0145KB-A) 30.6 100-pin TFLGA (PTLG0100JB-A) 30.9 64-pin TFBGA (PTBG0064KB-A) 32.0 144-pin LFQFP (PLQP0144KA-B) Ψjt 1.2 °C/W JESD51-2 and JESD51-7 compliant 100-pin LFQFP (PLQP0100KB-B) 1.2 64-pin LFQFP (PLQP0064KB-C) 1.2 48-pin HWQFN (PWQN0048KC-A) 0.1*1 145-pin TFLGA (PTLG0145JC-A) 0.4 JESD51-2 and JESD51-9 compliant 145-pin TFLGA (PTLG0145KB-A) 0.4 100-pin TFLGA (PTLG0100JB-A) 0.4 64-pin TFBGA (PTBG0064KB-A) 0.4 |
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