7.4 Thermal Information

THERMAL METRIC(1)

TPS3435

UNIT

DDF (SOT23-8)

8 PINS

RθJA

Junction-to-ambient thermal resistance

175.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

94.7

°C/W

RθJB

Junction-to-board thermal resistance

92.4

°C/W

ψJT

Junction-to-top characterization parameter

8.4

°C/W

ψJB

Junction-to-board characterization parameter

91.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TPS3435

SNVSCF7 – DECEMBER 2022

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