STM32C011F6U6 datasheet(83/94 Pages) STMICROELECTRONICS

Part #	STM32C011F6U6

Description	Arm® Cortex®-M0 32-bit MCU, 32 KB Flash, 6 KB RAM,2 x USART, timers, ADC, comm. I/Fs, 2-3.6 V

PDF	94 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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83 / 94 page

DS13866 Rev 3

83/94

STM32C011x4/x6

Package information

6.2

WLCSP12 package information

This WLCSP is a 12-ball, 1.70 x 1.42 mm, 0.35 mm pitch, wafer level chip scale package

Figure 30. WLCSP12 – Outline

1. Drawing is not to scale.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of

the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc

perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The

axis perpendicular to datum Z of each ball must lie within this tolerance zone.

B0EK_WLCSP12_ME_V1

(DETAIL B)

DETAIL B

(DETAIL A)

SIDE VIEW

BOTTOM VIEW

SIDE VIEW

eee

aaa

TOP VIEW

B1 Orientation ref

BUMP

b (Nx)

ddd

ccc

SEATING

PLANE

DETAIL A

ROATATED 90

STM32C011F6U6 Datasheet(PDF) 83 Page - STMicroelectronics