HC05RC17GRSSLASHD datasheet(16/128 Pages) NXP

16 / 128 page

General Description

General Release Specification

MC68HC05RC17 — Rev. 2.0

General Description

The MC68HC05RC17 is available in 28-pin small outline integrated

circuit (SOIC) or plastic dual in-line package (PDIP) packages. Four

additional I/O lines are available for bond out in higher pin count

packages.

NOTE:

Consult the factory for availability of 28-pin dual in-line and higher pin

count packages.

1.3 Features

Features of the MC68HC05RC17 include:

• Low Cost

• HC05 Core

• 28-Pin SOIC or DIP Packages

• On-Chip Oscillator with 32.768-kHz Crystal/Ceramic Resonator

• Phase-Locked Loop (PLL) Synthesizer with Programmable Speed

• 15,936 Bytes of User ROM

• 64 Bytes of Burn-In ROM

• 352 Bytes of On-Chip RAM

• 14-Stage Core Timer with Real-Time Interrupt (RTI) and

Computer Operating Properly (COP) Watchdog Circuits

• Carrier Modulator Transmitter Supporting Baseband, Pulse

Length Modulator (PLM), and Frequency Shift Keying (FSK)

Protocols

• Low-Power Reset Pin

• 18 Bidirectional I/O Lines (Four Additional I/O Lines Available for

Bond Out in Higher Pin Count Packages)

• Mask Programmable Pullups and Interrupt on Eight Port Pins

(PB0–PB7)

• High-Current Infrared (IR) Drive Pin

• High-Current Port Pin (PC0)

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

HC05RC17GRS/D Datasheet(PDF) 16 Page - NXP Semiconductors