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MPC750EC/D Datasheet(PDF) 24 Page - NXP Semiconductors |
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MPC750EC/D Datasheet(HTML) 24 Page - NXP Semiconductors |
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24 / 44 page ![]() 24 MPC750A RISC Microprocessor Hardware Specifications Pin Assignments Figure 15 (in part A) shows the pinout of the MPC750, 360 CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top surface view. Part A Figure 15. Pinout of the MPC750, 360 CBGA Package as Viewed from the Top Surface A B C D E F G H J K L M N P R T 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Not to Scale 17 18 19 U V W View Part B Die Substrate Assembly Encapsulant Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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