MPC750ECSLASHD datasheet(29/44 Pages) NXP

Part #	MPC750EC/D

Description	MPC750A RISC Microprocessor Hardware Specifications

PDF	44 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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29 / 44 page

MPC750A RISC Microprocessor Hardware Speciﬁcations

Package Description

1.7 Package Description

The following sections provide the package parameters and mechanical dimensions for the MPC740, 255

CBGA packages.

1.7.1 Parameters for the MPC740

The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead

ceramic ball grid array (CBGA).

Package outline

21 x 21 mm

Interconnects

255 (16 x 16 ball array - 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.45 mm

Maximum module height

3.00 mm

Ball diameter

0.89 mm (35 mil)

1.7.2 Mechanical Dimensions of the MPC740

Figure 16 provides the mechanical dimensions and bottom surface nomenclature of the MPC740, 255

CBGA package.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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D B

Y F

INC

MPC750EC/D Datasheet(PDF) 29 Page - NXP Semiconductors