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MPC750EC/D Datasheet(PDF) 30 Page - NXP Semiconductors

Part # MPC750EC/D
Description  MPC750A RISC Microprocessor Hardware Specifications
PDF  44 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC750EC/D Datasheet(HTML) 30 Page - NXP Semiconductors

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MPC750A RISC Microprocessor Hardware Specifications
Package Description
Figure 16. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC740
1.7.3 Parameters for the MPC750
The package parameters are as provided in the following list. The package type is 25 x 25 mm, 360-lead
ceramic ball grid array (CBGA).
Package outline
25 x 25 mm
Interconnects
360 (19 x 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.65 mm
Maximum module height
3.20 mm
Ball diameter
0.89 mm (35 mil)
Notes:
Dimensioning and tolerancing per
ASME Y14.5M, 1994.
Dimensions in millimeters.
Top side A1 corner index is a metalized
feature with various shapes. bottom side
A1 corner is designated with a ball
0.2
B
C
255X
D
2X
A1 CORNER
E
e
E1
D1
0.2
2X
B
A
123456789 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
e/2
A
0.3
C
0.15
b
e/2
A
A1
A2
C
0.15 C
M
Millimeters
DIM
Min
Max
A
2.45
3.00
A1
0.79
0.99
A2
0.9
1.10
b
0.82
0.93
D
21.00 BSC
D1
8.3
8.5
e
1.27 BSC
E
21.00 BSC
E1
9.0
9.2
M
2.00
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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