UPD703003A datasheet(40/45 Pages) RENESAS

40 / 45 page

µPD703003A, 703004A, 703025A, 703003A(A), 703025A(A)

Data Sheet U13188EJ6V1DS

Table 5-1. Surface Mounting Type Soldering Conditions (2/2)

(2)

µPD703003AGC-33-xxx-8EU-A: 100-pin plastic LQFP (fine pitch) (14 × 14)

µPD703025AGC-33-xxx-8EU-A: 100-pin plastic LQFP (fine pitch) (14 × 14)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

IR60-207-3

Wave soldering

—

Partial heating

—

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Remarks 1. Products with -A at the end of the part number are lead-free products.

2. For soldering methods and conditions other than those recommended above, consult an NEC

Electronics sales representative.

Package peak temperature: 260

°C, Time: 60 seconds max. (at 220°C or

higher), Count: Three times or less, Exposure limit: 7 daysNote (after that,

prebake at 125

°C for 20 to 72 hours)

For details, consult an NEC Electronics sales representative.

Pin temperature: 350

°C max., Time: 3 seconds max. (per pin row)

UPD703003A Datasheet(PDF) 40 Page - Renesas Technology Corp