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PACKAGE OUTLINE

C

4X

0.27

0.17

0.8 0.1

4X

0.25

0.15

0.6 0.1

0.05

0.00

0.4 MAX

2X 0.5

A

1.45

1.35

B

1.15

1.05

(0.13) TYP

X2SON - 0.4 mm max height

DMR0004A

PLASTIC SMALL OUTLINE - NO LEAD

4222825/B 05/2022

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

NOTE 4

1

2

3

4

(OPTIONAL)

PIN 1 ID

0.1

C B

A

0.05

C

EXPOSED

THERMAL PAD

5

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4. Quantity and shape of side wall metal may vary.

NOTE 4

SCALE 9.000