6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Power supply voltage

VCC

–0.3

5.5

V

Power supply voltage slew rate

VCC

Unlimited

V / µs

Output voltage

OUT, OUT1, OUT2

–0.3

VCC + 0.3

V

Output current

OUT, OUT1, OUT2

–5

5

mA

Magnetic flux density, BMAX

Unlimited

T

Junction temperature, TJ

105

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC

JS-001(1)

±6000

V

Charged-device model (CDM), per JEDEC specification

JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Power supply voltage

1.65

5.5

V

VO

Output voltage

0

5.5

V

IO

Output current

–5

5

mA

TA

Operating ambient temperature

–40

85

°C

6.4 Thermal Information

THERMAL METRIC(1)

DRV5032

UNIT

DBZ (SOT-23)

DMR (X2SON)

LPG (TO-92)

3 PINS

4 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

356

159

183.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

128

77

74.2

°C/W

RθJB

Junction-to-board thermal resistance

94

102

158.8

°C/W

ΨJT

Junction-to-top characterization parameter

11.4

0.9

15.2

°C/W

ΨJB

Junction-to-board characterization parameter

92

100

158.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

DRV5032

SLVSDC7G – APRIL 2017 – REVISED JULY 2024

www.ti.com

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