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M24C64-R Datasheet(PDF) 45 Page - STMicroelectronics |
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M24C64-R Datasheet(HTML) 45 Page - STMicroelectronics |
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45 / 54 page ![]() DS6638 Rev 36 45/54 M24C64-W M24C64-R M24C64-F M24C64-DF Package information 53 9.8 WLCSP8 thin package information Figure 29. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. |
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