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M24C64-R Datasheet(PDF) 53 Page - STMicroelectronics |
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M24C64-R Datasheet(HTML) 53 Page - STMicroelectronics |
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53 / 54 page  DS6638 Rev 36 53/54 M24C64-W M24C64-R M24C64-F M24C64-DF Revision history 53 13-Sep-2017 34 Added reference to DFN8 and DFN5 in: cover page figure, Figure 3: UFDFPN5 (DFN5) package connections, Section 9.1: UFDFPN5 (DFN5) package information, Section 9.2: UFDFPN8 (DFN8) package information and Table 29: Ordering information scheme. Added Figure 19: UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead recommended footprint. Updated Section Table 28.: Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package mechanical data 16-Nov-2017 35 Updated Table 29: Ordering information scheme 14-Mar-2018 36 Added Table 3: WLCSP 5-bump signals vs. bump position, Table 4: WLCSP 8-bump signals vs bump position Updated Figure 6: WLCSP 8-bump thin connections (M24C64- DFCT6TP/K) Table 31. Document revision history (continued) Date Revision Changes |
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