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M24C64-R Datasheet(PDF) 41 Page - STMicroelectronics |
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M24C64-R Datasheet(HTML) 41 Page - STMicroelectronics |
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41 / 54 page ![]() DS6638 Rev 36 41/54 M24C64-W M24C64-R M24C64-F M24C64-DF Package information 53 9.6 WLCSP4 ultra thin package information Figure 25. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm,wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 26. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.285 0.315 0.345 0.0112 0.0124 0.0136 A1 - 0.115 - - 0.0045 - A2 - 0.175 - - 0.0069 - A3 (BSC) - 0.025 - - 0.0010 - b(2) (3) - 0.160 - - 0.0063 - D - 0.795 0.815 - 0.0313 0.0321 E - 0.674 0.694 - 0.0265 0.0273 e - 0.400 - - 0.0157 - F - 0.137 - - 0.0054 - G - 0.198 - - 0.0078 - aaa - - 0.110 - - 0.0043 |
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