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M24C64-R Datasheet(PDF) 42 Page - STMicroelectronics |
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M24C64-R Datasheet(HTML) 42 Page - STMicroelectronics |
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42 / 54 page ![]() Package information M24C64-W M24C64-R M24C64-F M24C64-DF 42/54 DS6638 Rev 36 Figure 26. Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. bbb - - 0.110 - - 0.0043 ccc - - 0.110 - - 0.0043 ddd - - 0.060 - - 0.0024 eee - - 0.060 - - 0.0024 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 26. Ultra Thin WLCSP- 4-bump, 0.795 x 0.674 mm, wafer level chip scale package mechanical data (continued) |
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