M24C64-R datasheet(46/54 Pages) STMICROELECTRONICS

46 / 54 page

Package information

M24C64-W M24C64-R M24C64-F M24C64-DF

46/54

DS6638 Rev 36

Figure 30. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

Table 28. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.300

0.315

0.330

0.0118

0.0124

0.0130

0.115

0.0045

0.200

0.0079

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.160

0.0063

1.073

1.093

0.0422

0.0430

0.959

0.979

0.0378

0.0385

0.693

0.0273

0.800

0.0315

0.400

0.0157

0.133

0.0052

0.137

0.0054

aaa

0.110

0.0043

bbb

0.110

0.0043

ccc

0.110

0.0043

ddd

0.060

0.0024

eee

0.060

0.0024

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