LMH6570

SNCS104D – APRIL 2005 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Supply Voltage (V+

− V−)

13.2

V

IOUT

(3)

130

mA

Signal & Logic Input Pin Voltage

±(VS + 0.6)

V

Signal & Logic Input Pin Current

±20

mA

Maximum Junction Temperature

+150

°C

Storage Temperature

−65

+150

°C

Infrared or Convection (20 sec)

235

°C

Soldering Information

Wave Soldering (10 sec)

260

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical

Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

The maximum output current (IOUT) is determined by the device power dissipation limitations (The junction temperature cannot be

allowed to exceed 150°C). See Power Dissipation for more details. A short circuit condition should be limited to 5 seconds or less.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Machine model (MM)(2)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. Human

body model, 1.5k

Ω in series with 100 pF.

(2)

Machine model, 0

Ω In series with 200 pF

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating Temperature

−40

85

°C

Supply Voltage

6

12

V

6.4 Thermal Information

D

THERMAL METRIC(1)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

150

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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