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L6711 Datasheet(PDF) 10 Page - STMicroelectronics

Part # L6711
Description  3 Phase controller with dynamic VID and selectable DACs
PDF  50 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6711 Datasheet(HTML) 10 Page - STMicroelectronics

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Pins description and connection diagrams
L6711
10/50
23, 24
to 28
VID5,
VID0-4
Voltage IDentification pins.
Internally pulled-up to 3V, connect to SGND to program a logic ‘0’ while leave floating (as well
as pull-up with a resistor up to 3.3V) to program a logic ‘1’.
They are used to program the output voltage as specified in Table 5 and Table 6 together with
VID_SEL and to set the OVP/UVP protection thresholds accordingly.
See relevant section for details about DAC selection.
29
VID_SEL
VID_SELect pin. Through this pin it is possible to select the DAC table used for the regulation.
Leave floating to use a VRD10.x compliant DAC (See Table 1) while short to SGND to use a
VRM-Hammer compliant DAC (See Table 3).
See relevant section for details about DAC selection.
30
SS_END
Soft start end signal. It is an open collector output, set free after finishing the soft start.
Pull-up with a resistor to a voltage lower than 5V, if not used may be left floating.
31
SGND
All the internal references are referred to this pin. Connect it to the PCB signal ground.
32
PHASE3
Channel 3 HS driver return path. It must be connected to the HS3 mosfet source and provides
the return path for the HS driver of channel 3.
33
UGATE3
Channel 3 HS driver output.
A little series resistor helps in reducing device-dissipated power.
34
BOOT3
Channel 3 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE3 pin and through a diode to VCC
(cathode vs. boot).
35
PGND3
Channel 3 LS driver return path.
Connect to Power Ground Plane.
36
LGATE3
Channel 3 LS driver output.
A little series resistor helps in reducing device-dissipated power.
37
N.C.
Not internally connected.
38
VCCDR3
Channel 3 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
µF ceramic cap vs. PGND3.
39
PGND2
Channel 2 LS driver return path.
Connect to Power Ground Plane.
40
LGATE2
Channel 2 LS driver output.
A little series resistor helps in reducing device-dissipated power.
41
VCCDR2
Channel 2 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
µF ceramic cap vs. PGND2.
42
PHASE2
Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and provides
the return path for the HS driver of channel 2.
43
UGATE2
Channel 2 HS driver output.
A little series resistor helps in reducing device-dissipated power.
44
BOOT2
Channel 2 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE2 pin and through a diode to VCC
(cathode vs. boot).
Table 1.
Pins description (continued)
N°
Name
Description



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