L6711 datasheet(11/50 Pages) STMICROELECTRONICS

Part #	L6711

Description	3 Phase controller with dynamic VID and selectable DACs

PDF	50 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

Logo

11 / 50 page

L6711

Pins description and connection diagrams

11/50

BOOT1

Channel 1 HS driver supply. This pin supplies the relative high side driver.

Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC

(cathode vs. boot).

UGATE1

Channel 1 HS driver output.

A little series resistor helps in reducing device-dissipated power.

PHASE1

Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides

the return path for the HS driver of channel 1.

N.C.

Not internally connected.

PAD

THERMAL

PAD

Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to

dissipate the power necessary to drive the external mosfets. Connect to the GND plane with

several vias to improve thermal conductivity.

Table 1.

Pins description (continued)

N°

Name

Description

L6711 Datasheet(PDF) 11 Page - STMicroelectronics