R5F526TBAGFM datasheet(70/142 Pages) RENESAS

70 / 142 page

R01DS0407EJ0120 Rev.1.20

Page 70 of 142

Oct 31, 2024

RX26T Group

2. Electrical Characteristics

Note:

The values are reference values when the 4-layer printed circuit board is used. Thermal resistance depends on the number of

layers and size of the board. For details, refer to the JEDEC standards.

Note 1. The listed value applies when the exposed die pad is connected to VSS.

Table 2.13

Thermal Resistance Value (Reference)

Conditions: VCC = 2.7 to 5.5 V, AVCC0 = AVCC1 = AVCC2 = 3.0 to 5.5 V,

VSS = AVSS0 = AVSS1 = AVSS2 = 0 V,

Ta = Topr

Item

Package

Symbol

Min.

Typ.

Max.

Unit

Test Conditions

Thermal resistance

100-pin LFQFP (PLQP0100KB-B)

ja

—

50.5

°C/W

JESD51-2 and

JESD51-7 compliant

80-pin LFQFP (PLQP0080KB-B)

—

47.7

64-pin LFQFP (PLQP0064KB-C)

—

51.9

64-pin HWQFN (PWQN0064KF-A)

—

18.4*1

48-pin LFQFP (PLQP0048KB-B)

—

60.8

48-pin HWQFN (PWQN0048KC-A)

—

19.5*1

32-pin HWQFN (PWQN0032KE-A)

—

26.3*1

100-pin LFQFP (PLQP0100KB-B)

jt

—

1.39

°C/W

JESD51-2 and

JESD51-7 compliant

80-pin LFQFP (PLQP0080KB-B)

—

1.39

64-pin LFQFP (PLQP0064KB-C)

—

1.88

64-pin HWQFN (PWQN0064KF-A)

—

0.12*1

48-pin LFQFP (PLQP0048KB-B)

—

2.38

48-pin HWQFN (PWQN0048KC-A)

—

0.12*1

32-pin HWQFN (PWQN0032KE-A)

—

0.28*1

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