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STM32W108HB Datasheet(PDF) 167 Page - STMicroelectronics

Part # STM32W108HB
Description  High-performance, IEEE 802.15.4 wireless system-on-chip
PDF  179 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32W108HB Datasheet(HTML) 167 Page - STMicroelectronics

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STM32W108CB, STM32W108HB
Electrical characteristics
Doc ID 16252 Rev 2
167/179
ARM® Cortex-M3, RAM, and flash
memory sleep current
25 °C, 1.8 V memory and
1.25 V core
ARM® Cortex-M3 clocked at
12 MHz from the crystal
oscillator
Radio and all peripherals off
4.0
mA
ARM® Cortex-M3, RAM, and flash
memory sleep current
25 °C, 1.8 V memory and
1.25 V core
ARM® Cortex-M3 clocked at
6 MHz from the high frequency
RC oscillator
Radio and all peripherals off
2.0
mA
Serial controller current
For each controller at
maximum data rate
0.2
mA
General purpose timer current
For each timer at maximum
clock rate
0.1
mA
General purpose ADC current
At maximum sample rate, DMA
enabled
1.1
mA
Rx current
Radio receiver, MAC, and
baseband
ARM® Cortex-M3 sleeping
20.0
mA
Total RX current ( = IRadio receiver,
MAC and baseband, CPU + IRAM, and
Flash memory )
VDD_PADS = 3.0 V, 25 °C,
ARM® Cortex-M3 running at
12 MHz
27.0
mA
VDD_PADS = 3.0 V, 25 °C,
ARM® Cortex-M3 running at
24 MHz
28.0
mA
Boost mode total RX current ( =
IRadio receiver, MAC and baseband,
CPU+ IRAM, and Flash memory )
VDD_PADS = 3.0 V, 25 °C,
ARM® Cortex-M3 running at
12 MHz
28.0
mA
VDD_PADS = 3.0 V, 2 5°C,
ARM® Cortex-M3 running at
24 MHz
29.0
mA
Tx current
Radio transmitter, MAC, and
baseband
25 °C and 1.8 V core; max.
power out (+3 dBm typical)
ARM® Cortex-M3 sleeping
26.0
mA
Table 40.
DC electrical characteristics (continued)
Parameter
Conditions
Min.
Typ.
Max.
Unit



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