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PCIMX536AVV8C Datasheet(PDF) 19 Page - Freescale Semiconductor, Inc

Part # PCIMX536AVV8C
Description  Automotive and Infotainment Applications Processors
PDF  178 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

PCIMX536AVV8C Datasheet(HTML) 19 Page - Freescale Semiconductor, Inc

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Electrical Characteristics
i.MX53xA Automotive and Infotainment Applications Processors, Rev. 2
Freescale Semiconductor
19
4.1.2
Thermal Resistance
4.1.2.1
TEPBGA-2 Package Thermal Resistance
Table 5 provides the TEPBGA-2 package thermal resistance data.
Table 5. TEPBGA-2 Package Thermal Resistance Data
Rating
Board
Symbol
Value
Unit
Junction to Ambient (natural convection)1, 2
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Single layer board
(1s)
RθJA
28
°C/W
Junction to Ambient (natural convection)1, 2, 3
3 Per JEDEC JESD51-6 with the board horizontal.
Four layer board
(2s2p)
RθJA
16
°C/W
Junction to Ambient (at 200 ft/min)1, 3
Single layer board
(1s)
RθJMA
21
°C/W
Junction to Ambient (at 200 ft/min)1, 3
Four layer board
(2s2p)
RθJMA
13
°C/W
Junction to Board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
—RθJB
6°C/W
Junction to Case5
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
—RθJC
4°C/W
Junction to Package Top (natural convection)6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
—
Ψ
JT
4°C/W



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