TMS320DM8147 datasheet(6/360 Pages) TI1

6 / 360 page

TMS320DM8148, TMS320DM8147, TMS320DM8146

SPRS647B

– MARCH 2011 – REVISED SEPTEMBER 2011

www.ti.com

High-Performance System-on-Chip (SoC)

......... 1

Module

............................................ 179

1.1

Features

.............................................. 1

7.2

Power

.............................................. 179

7.3

Reset

.............................................. 186

1.2

Applications

.......................................... 3

7.4

Clocking

........................................... 194

1.3

Description

........................................... 4

7.5

Interrupts

.......................................... 210

1.4

Functional Block Diagram

............................ 5

Peripheral Information and Timings

............. 217

Revision History

.............................................. 7

8.1

Parameter Information

............................ 217

Device Overview

....................................... 11

8.2

Recommended Clock and Control Signal Transition

2.1

Device Comparison

................................. 11

Behavior

........................................... 218

8.3

Controller Area Network Interface (DCAN)

....... 218

2.2

Device Characteristics

.............................. 11

8.4

EDMA

............................................. 220

2.3

Device Compatibility

................................ 13

8.5

Emulation Features and Capability

............... 223

2.4

ARM

® Cortex™-A8 Microprocessor Unit (MPU)

Subsystem Overview

............................... 13

8.6

Ethernet MAC Switch (EMAC SW)

................ 227

2.5

C674x

™ DSP Overview

............................ 15

8.7

General-Purpose Input/Output (GPIO)

............ 242

8.8

General-Purpose Memory Controller (GPMC) and

2.6

DSP/EDMA Memory Management Unit (MMU)

.... 19

Error Location Module (ELM)

..................... 245

2.7

Media Controller Overview

......................... 20

8.9

High-Definition Multimedia Interface (HDMI)

...... 262

2.8

HDVICP2 Overview

................................. 20

8.10

High-Definition Video Processing Subsystem

(HDVPSS)

......................................... 265

2.9

SGX530 Overview

.................................. 21

8.11

Inter-Integrated Circuit (I2C)

...................... 271

2.10

Spinlock Module Overview

......................... 21

8.12

Imaging Subsystem (ISS)

......................... 275

2.11

Mailbox Module Overview

.......................... 22

8.13

LPDDR/DDR2/DDR3 Memory Controller

......... 278

2.12

Memory Map Summary

............................. 23

8.14

Multichannel Audio Serial Port (McASP)

.......... 311

Device Pins

............................................. 32

8.15

Multichannel Buffered Serial Port (McBSP)

....... 319

3.1

Pin Maps

............................................ 32

8.16

MultiMedia Card/Secure Digital/Secure Digital Input

3.2

Terminal Functions

................................. 41

Output (MMC/SD/SDIO)

........................... 324

Device Configurations

.............................. 150

8.17

Peripheral Component Interconnect Express (PCIe)

..................................................... 327

4.1

Control Module Registers

......................... 150

8.18

Serial ATA Controller (SATA)

..................... 332

4.2

Boot Modes

....................................... 150

8.19

Serial Peripheral Interface (SPI)

.................. 336

4.3

Pin Multiplexing Control

........................... 157

8.20

Timers

............................................. 343

4.4

Handling Unused Pins

............................ 167

8.21

Universal Asynchronous Receiver/Transmitter

4.5

DeBugging Considerations

........................ 167

(UART)

............................................ 345

8.22

Universal Serial Bus (USB2.0)

.................... 347

System Interconnect

................................ 169

Device and Documentation Support

............. 355

Device Operating Conditions

...................... 174

9.1

Device Support

.................................... 355

6.1

Absolute Maximum Ratings

....................... 174

9.2

Documentation Support

........................... 356

6.2

Recommended Operating Conditions

............. 175

9.3

Community Resources

............................ 356

6.3

Electrical Characteristics Over Recommended

Ranges of Supply Voltage and Operating

Mechanical

............................................ 357

Temperature (Unless Otherwise Noted)

.......... 177

10.1

Thermal Data for CYE-04 (Top Hat)

.............. 357

Power, Reset, Clocking, and Interrupts

......... 179

10.2

Packaging Information

............................ 357

7.1

Power, Reset and Clock Management (PRCM)

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