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PD70F3559 Datasheet(PDF) 6 Page - Renesas Technology Corp

Part # PD70F3559
Description  32-bit Single-Chip Microcontroller
PDF  85 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

PD70F3559 Datasheet(HTML) 6 Page - Renesas Technology Corp

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R01DS0142ED0100
Data Sheet
Notes for CMOS Devices
(1)
Precaution against ESD for semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred. Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to
avoid using insulators that easily build static electricity. Semiconductor devices
must be stored and transported in an anti-static container, static shielding bag
or conductive material. All text and measurement tools including work bench
and floor should be grounded. The operator should be grounded using wrist
strap. Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices on it.
(2)
Handling of unused input pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level
may be generated due to noise, etc., hence causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry. Each unused pin should be connected to VDD or GND with a resistor,
if it is considered to have a possibility of being an output pin. All handling
related to the unused pins must be judged device by device and related
specifications governing the devices.
(3)
Status before initialization of MOS devices
Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately
after power-on for devices having reset function.



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