W25Q80BVCIP datasheet(6/74 Pages) WINBOND

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W25Q128BV

- 6 -

3. PACKAGE TYPES AND PIN CONFIGURATIONS

W25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package

code F) and two 24-ball 8x6-mm TFBGAs (package code B, C) as shown in Figure 1a-c respectively.

Package diagrams and dimensions are illustrated at the end of this datasheet.

3.1

Pad Configuration WSON 8x6-mm

/CS

DO (IO

/WP (IO

GND

VCC

/HOLD (IO

DI (IO

CLK

Top View

Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)

3.2

Pad Description WSON 8x6-mm

PAD NO.

PAD NAME

I/O

FUNCTION

/CS

Chip Select Input

DO (IO1)

I/O

Data Output (Data Input Output 1)*

/WP (IO2)

I/O

Write Protect Input ( Data Input Output 2)*

GND

Ground

DI (IO0)

I/O

Data Input (Data Input Output 0)*

CLK

Serial Clock Input

/HOLD (IO3)

I/O

Hold Input (Data Input Output 3)*

VCC

Power Supply

*1: IO0 and IO1 are used for Standard and Dual SPI instructions

*2: IO0

– IO3 are used for Quad SPI instructions

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