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AS4LC4M16S0 Datasheet(PDF) 1 Page - Alliance Semiconductor Corporation

Part # AS4LC4M16S0
Description  3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM
PDF  24 Pages
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4LC4M16S0 Datasheet(HTML) 1 Page - Alliance Semiconductor Corporation

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Advance information
Copyright ©2000 Alliance Semiconductor. All rights reserved.
®
AS4LC8M8S0
AS4LC4M16S0
7/5/00
ALLIANCE SEMICONDUCTOR
1
3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM
Features
• PC100/133 compliant
• Organization
- 2,097,152 words × 8 bits × 4 banks (8M×8)
- 1,048,576 words × 16 bits × 4 banks (4M×16)
• Fully synchronous
- All signals referenced to positive edge of clock
• Four internal banks controlled by BA0/BA1 (bank select)
•High speed
- 133/125/100 MHz
- 5.4 ns (133 MHz)/6 ns (125/100 MHz) clock access time
• Low power consumption
- Standby: 7.2 mW max, CMOS I/O
• 4096 refresh cycles, 64 ms refresh interval
• Auto refresh and self refresh
• Automatic and direct precharge
• Burst read, single write operation
• Can assert random column address in every cycle
• LVTTL compatible I/O
• 3.3V power supply
• JEDEC standard package, pinout and function
- 400 mil, 54-pin TSOP II
• Read/write data masking
• Programmable burst length (1/2/4/8/full page)
• Programmable burst sequence (sequential/interleaved)
• Programmable CAS latency (2/3)
Pin arrangement
A3
VCC
A4
VSS
VCC
DQ0
VCCQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VCCQ
DQ5
DQ6
VSSQ
DQ7
VCC
LDQM
VSS
DQ15
VSSQ
DQ14
DQ13
VCCQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VCCQ
DQ8
VSS
NC
UDQM
CLK
CKE
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
32
31
30
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
NC
A11
A9
A8
A7
A6
A5
26
27
29
28
NC
DQ1
NC
DQ2
NC
DQ3
NC
NC
DQ7
NC
DQ6
NC
DQ5
NC
DQ4
NC
DQM
A3
VCC
VCC
DQ0
VCCQ
VSSQ
VCCQ
VSSQ
VCC
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A4
VSS
VSS
VSSQ
VCCQ
VSSQ
VCCQ
VSS
NC
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
AS4LC4M16S0
AS4LC4M16S0
Pin designation
Pin(s)
Description
DQM (8M×8)
UDQM/LDQM (4M×16)
Output disable/write mask
A0 to A11
Address inputs
BA0, BA1
Bank select inputs
DQ0 to DQ7 (8M×8)
DQ0 to DQ15 (4M×16)
Input/output
RAS
Row address strobe
CAS
Column address strobe
WE
Write enable
CS
Chip select
VCC, VCCQ
Power (3.3V ± 0.3V)
VSS, VSSQ
Ground
CLK
Clock input
CKE
Clock enable
Selection guide
Symbol
-75 (PC133)
-8
-10F (PC100)
-10 (PC100)
Unit
Bus frequency
fmax
133
125
100
100
MHz
Minimum clock access time
CL = 2
tAC
––
6–
ns
CL = 3
tAC
5.4
6
6
ns
Minimum setup time
tS
1.5
2
2
2
ns
Minimum hold time
tH
0.81.0
1.01.0
ns
Minimum RAS to CAS delay
tRCD
3323
cycles
Minimum RAS precharge time
tRP
3323
cycles
Remarks: (CL/tRCD/tRP)
3/3/3
3/3/3
2/2/2
3/3/3


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